1. 2. 3. material content data sheet sales product name bsp742r issued 29. august 2013 ma# MA000975730 package pg-dso-8-24 weight* 83.23 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.539 1.85 1.85 18487 18487 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 108 non noble metal zinc 7440-66-6 0.036 0.04 431 non noble metal iron 7439-89-6 0.717 0.86 8617 non noble metal copper 7440-50-8 29.121 34.99 35.90 349903 359059 wire noble metal gold 7440-57-5 0.471 0.57 0.57 5660 5660 encapsulation organic material carbon black 1333-86-4 0.099 0.12 1184 plastics epoxy resin - 4.532 5.45 54456 inorganic material silicondioxide 60676-86-0 44.632 53.62 59.19 536270 591910 leadfinish non noble metal tin 7440-31-5 0.814 0.98 0.98 9779 9779 plating noble metal silver 7440-22-4 0.650 0.78 0.78 7813 7813 glue plastics epoxy resin - 0.106 0.13 1276 noble metal silver 7440-22-4 0.501 0.60 0.73 6016 7292 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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